The Cavitt Group was formed in 1995 by two electro-mechanical packaging designers who have collaborated on multiple projects for well over 22 years.

Merging of those talents brings together over 60 years of experience in electromechanical packaging with specialized expertise in printed wiring board design. Our mission is to generate designs and documentation products that are of high quality, accuracy and completed in a timely manner.

Our areas of expertise encompass the following:

• Printed Wiring Board Design (SMT, Thru-hole, Multilayer, etc.)
• Analog, Digital, RF, High Voltage, Controlled Impedance and Stripline
• Schematic Capture
• Electromechancal Packaging (conceptual design & detailing)
• Geometric Tolerancing and Dimensioning
• System Level Documentation (Level 1-3)
• Wiring, Functional and Interconnection Diagrams
• Cables assembly and Wiring Harnesses

Some of the companies that have used 
The Cavitt Group's design services are:

• Linear Technology
• SSE Technologies
• Grant Enterprises
• Atlantic Pacific Technologies
• Zircon
• Sacramento Army Depot
• Physics International
• Quality Electronics
• Intel

Contact Information:

Cavitt Group

4719 Quail Lakes Drive, Suite G-246

Stockton, CA., 95207

Mobile: 209-470-7636

FAX: 209-474-8430